When it comes to measuring the ecological impact of chips during their operation in the end-product, it is difficult to come up with reliable and detailed data. One key challenge is that, according to the GHG Protocol guidance for scope 3, semiconductor manufacturers (both in front- and back-end manufacturing) do not need to report on their climate footprint, particularly with regard to emissions, as their products are classified as ‘intermediate products’ and are not directly sold as end-products

To GHG Protocol’s credit, the organization does ask companies to report location-based figures alongside their Rec-based figures. Despite that, no company includes both location-based and market-based metrics for all three subcategories of emissions in the bodies of their annual environmental reports.